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Tuff Slim Armor Hybrid Ring Stand Case for Samsung Galaxy S23 FE

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Funda híbrida con soporte de anillo Tuff Slim Armor para Samsung Galaxy S23 FE (negra) Compatible con Samsung Galaxy S23 FE Esquinas Air-Guard que absorben los impactos y ofrecen protección adicional contra caídas y golpes de corta distancia. Diseño de soporte incorporado, este estuche le proporciona una pantalla completa al plegarlo hacia atrás...
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MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/
  • MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/
  • MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/
  • MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/
  • MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/
  • MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/

MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/i7/i9 12th 13th Processor CPU Dual Channel Memory

12000039692936889
Valoración 

MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/i7/i9 12th 13th Processor CPU Dual Channel Memory

Bundle
$113,41
Impuestos incluidos
Cantidad

  Política de seguridad

(editar con el módulo de Información de seguridad y confianza para el cliente)

  Política de entrega

(editar con el módulo de Información de seguridad y confianza para el cliente)

  Política de devolución

(editar con el módulo de Información de seguridad y confianza para el cliente)

Descripción

*Startup item shortcut key: f11;

*Support network wake-up;

*Support Re-Size BAR Support;

*Support TPM2.0; support XMP.


Package contains:

#Main products: MACHINIST B760 GT4 motherboard*1 piece;

##Bonus accessories: I/O shield, SATA cable.

### They are all packaged after manual testing before sending. If there are any gifts missing, please understand!


Motherboard information:

>>Brand: MACHINIST.

>>Motherboard model: B760 GT4.

>>Processor: Supports Intel LGA 1700-pin series processors.

>> Chipset: B760 chipset.


>>Memory

Technology: Dual Channel DDR4. Support 2133/2666/3000/3200/3600MHz.

Maximum capacity 64GB (32G x 2).

Memory slot: 2*288 PIN DDR4.

Supported memory types: Only DDR4 desktop memory is supported.

(Note: Please use Samsung, Kingston, Sandee, Micron, Hynix and other international brands. Other brands may not be compatible.)


>> Rear I/O

PS/2: 1 KB port + 1 MS port.

Display interface: supports VGA & HDMI & DP three-way simultaneous display.

USB interface: 2 USB 2.0; 4 USB3.2.

Ethernet: Gigabit network adapter port.

Audio: 1 (mic in, line out, line in).


>> Internal connector

SATA interface: 3 (SATA3.0).

M.2: Two (1*PCIe 4.0 x4 NVME; 1*PCIe 4.0 x4 NVME/SATA).

WIFI M.2: Does not support CNVI protocol, only supports PCIe protocol

F_AUDIO: 2x5Pin pin.

PCIe: 1 X16 4.0 PCIe and 1 X1 PCIe.

F_PANEL: 1 2x5 pin.


>> Dimensions

Size: 240mm*190mm.

Motherboard weight (including packaging): about 0.85 kg.









Notice:

(1) The color of the tank bottom plate may vary from batch to batch, but it will not affect the use of the product. Products are continuously optimized and upgraded.


(2) Due to manual measurement, please allow an error of 1-3mm.


(3)Due to different displays and different lights, the pictures may not show the actual color of the item. thank you for understanding.


(4) The platform requires a powerful power supply. Please make sure your power supply is sufficient for this platform. (At least 500w brand power supply)


(5) The battery in the motherboard photo is not included and will be removed before shipment because logistics requirements prohibit the use of this battery.


>> Regarding customs issues, please ensure that you can solve the customs clearance problem by yourself. If you cannot solve it, we do not recommend that you purchase goods in our store. We are not responsible for customs duties. thank you for understanding.

Detalles del producto
12000039692936889

Ficha técnica

Brand Name
MACHINIST
Origin
Mainland China
Certification
RoHS,CE
Package
Yes
Application
Desktop
RAID Supported
No
Processor compatibility
Intel Core
Usage Scenario
Gaming,Audio & Video,Household,Office,others
Back I/O Ports
1x RJ45,PS/2 Combo
Support USB Type
USB 3.0
Onboard LAN
1x RJ45
Number of M.2
1
Storage Interface Type
M.2 (NVMe)
Number of PCI
0
Number of PCIe x 1
1
Number of PCIe x 16
1
PCI - E standards
PCI - E 4.0
Number Of Memory Slots
2
Support Memory Type
DDR4
Memory channel
Double
Maximum Ram Capacity
64 GB
Form Factor
Micro-ATX
Chipset Manufacturer
Intel
With CPU
No
Chipset
Intel B760
Socket Type
LGA 1700
Quality Certification
ce,ROHS
Supports M.2 SSD
2280
Number of PCIe x 4
0
Number of PCIe x 8
0
Audio Channels
5.1
Ports
M.2
Special Features
None
Onboard Connectors & Header
CPU Fan Connector(s),AAFP Connector
SATA RAID
0
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MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/i7/i9 12th 13th Processor CPU Dual Channel Memory

MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/i7/i9 12th 13th Processor CPU Dual Channel Memory

MACHINIST B760 GT4 DDR4 Motherboard LGA 1700 Support Intel Core I3/i5/i7/i9 12th 13th Processor CPU Dual Channel Memory

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16 otros productos en la misma categoría:

Tuff Slim Armor Hybrid Ring Stand Case for Samsung Galaxy S23 FE

Reseña(s): 0
Funda híbrida con soporte de anillo Tuff Slim Armor para Samsung Galaxy S23 FE (negra) Compatible con Samsung Galaxy S23 FE Esquinas Air-Guard que absorben los impactos y ofrecen protección adicional contra caídas y golpes de corta distancia. Diseño de soporte incorporado, este estuche le proporciona una pantalla completa al plegarlo hacia atrás...
$12,72
Más
En stock

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