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Tuff Slim Armor Hybrid Ring Stand Case for Samsung Galaxy S23 FE

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Funda híbrida con soporte de anillo Tuff Slim Armor para Samsung Galaxy S23 FE (negra) Compatible con Samsung Galaxy S23 FE Esquinas Air-Guard que absorben los impactos y ofrecen protección adicional contra caídas y golpes de corta distancia. Diseño de soporte incorporado, este estuche le proporciona una pantalla completa al plegarlo hacia atrás...
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MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th
  • MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th
  • MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th
  • MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th
  • MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th

MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th CPU DDR5*4 M.2 PCIEX16 5.0 Desktop Computer components

12000047056567956
Valoración 

MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th CPU DDR5*4 M.2 PCIEX16 5.0 Desktop Computer components

Bundle
$223,65
Impuestos incluidos
Cantidad

  Política de seguridad

(editar con el módulo de Información de seguridad y confianza para el cliente)

  Política de entrega

(editar con el módulo de Información de seguridad y confianza para el cliente)

  Política de devolución

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Descripción

The CR2032 battery in motherboard photos will be removed before shipping, as battery is forbidden at CN post and custom

Power: Equipped with a robust 10-Phase Core and 50A Dr.Mos for efficient, stable power delivery and enhanced performance.

Cooling: Features advanced Alloy Armor for superior heat dissipation, keeping components cool under intense workloads.

Storage: Offers three high-speed M.2 SSD interfaces for expansive, fast storage solutions.

Connectivity: Includes a high-speed 2.5G LAN for faster and more reliable network connections.

Speed: Equipped with a front 20G Type-C port for ultra-fast data transfer and peripheral connectivity.











Detalles del producto
12000047056567956

Ficha técnica

Hign-concerned Chemical
None
Brand Name
MAXSUN
Origin
Mainland China
Package
Yes
Application
Desktop
RAID Supported
YES
Processor compatibility
13th Intel Core i7,12th Intel Core i5,13th Intel Core i5,12th Intel Core i3,12th Intel Core i9,13th Intel Core i3,12th Intel Core i7,13th Intel Core i9
Usage Scenario
Enthusiast & Overclocking,Gaming,Audio & Video,Office,Video Production,Video Rendering,MaxCompute
Back I/O Ports
1x RJ45,Displayport,HDMI 1.4
Support USB Type
USB 2.0,USB 3.1 Gen2,USB 3.2 Gen1
Onboard LAN
1x RJ45
Number of M.2
3
Storage Interface Type
SATA 3,M.2 (NVMe),M.2(SATA)
Number of PCI
3
PCI - E standards
PCI - E 4.0
Number Of Memory Slots
4
Support Memory Type
DDR5
Maximum Ram Capacity
128 GB
Chipset Manufacturer
Intel
With CPU
No
Chipset
Intel B760
Socket Type
LGA 1700
Number of SATA Ports
2
Supports M.2 SSD
2242,2280,22110
Audio Channels
7.1
Ports
Ethernet
Special Features
Cooling Armor
Onboard Connectors & Header
24-pin Main Power Connector,CPU Fan Connector(s),AAFP Connector,USB 3.1 /3.2 Gen 1 Connector,RGB Header,System Panel(s) (Chassis intrusion header is inbuilt)
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MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th CPU DDR5*4 M.2 PCIEX16 5.0 Desktop Computer components

MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th CPU DDR5*4 M.2 PCIEX16 5.0 Desktop Computer components

MAXSUN Gaming Mainboard B760M D5 Motherboard support Intel 14 13 12th CPU DDR5*4 M.2 PCIEX16 5.0 Desktop Computer components

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