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Tuff Slim Armor Hybrid Ring Stand Case for Samsung Galaxy S23 FE

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Funda híbrida con soporte de anillo Tuff Slim Armor para Samsung Galaxy S23 FE (negra) Compatible con Samsung Galaxy S23 FE Esquinas Air-Guard que absorben los impactos y ofrecen protección adicional contra caídas y golpes de corta distancia. Diseño de soporte incorporado, este estuche le proporciona una pantalla completa al plegarlo hacia atrás...
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Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer mothe
  • Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer mothe
  • Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer mothe
  • Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer mothe

Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer motherboards

12000043128701379
Valoración 

Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer motherboards

Bundle
$78,43
Impuestos incluidos
Cantidad

  Política de seguridad

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  Política de entrega

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Descripción
NOTE:NOT FULL NEW

Supports 9th and 8th Gen Intel® Core™ Processors
Dual Channel Non-ECC Unbuffered DDR4
New Hybrid Digital PWM Design
High Quality Audio Capacitors and Audio Noise Guard with LED Trace Path Lighting
Ultra-Fast M.2 with PCIe Gen3 X4 & SATA interface
RGB FUSION supports RGB LED strips in 7 colors
GIGABYTE Exclusive 8118 Gaming LAN with Bandwidth Management
CEC 2019 Ready, Save the Power as Easy as One Click
Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
Anti-Sulfur Resistors Design
Ultra Durable™ 15KV Surge LAN Protection
Intel® Optane™ Memory Ready
GIGABYTE UEFI DualBIOS™





CPU
Support for 9th and 8th Generation Intel® Core™ i7 processors/Intel® Core™ i5 processors/ Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1151 package
L3 cache varies with CPU
(Please refer "CPU Support List" for more information.)
Chipset
Intel® B360 Express Chipset
Memory
4 x DDR4 DIMM sockets supporting up to 64 GB of system memory
Dual channel memory architecture
Support for DDR4 2666/2400/2133 MHz memory modules
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
* To support 2666 MHz or XMP memory, you must install an 8th Generation Intel® Core™ i7/i5 processor.
(Please refer "Memory Support List" for more information.)
Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1200@60 Hz
* The DVI-D port does not support D-Sub connection by adapter.
1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
* Support for HDMI 1.4 version and HDCP 2.2.
Support for up to 3 displays at the same time
Maximum shared memory of 1 GB
Actual support may vary by CPU
Audio
Realtek® ALC887 codec
High Definition Audio
2/4/5.1/7.1-channel
* To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
Support for S/PDIF Out
LAN
Realtek® GbE LAN chip (10/100/1000 Mbit)
Expansion Slots
1 x PCI Express x16 slot, running at x16
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
1 x PCI Express x4 slot
1 x PCI Express x1 slot
(All of the PCI Express slots conform to PCI Express 3.0 standard.)
Storage Interface
Chipset:
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support)
6 x SATA 6Gb/s connectors
Intel® Optane™ Memory Ready
USB
Chipset:
6 x USB 3.1 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header)
6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers)
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x RGB LED strip header
1 x M.2 Socket 3 connector
6 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x USB 3.1 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x serial port header
1 x parallel port header
1 x Clear CMOS jumper
Back Panel Connectors
1 x PS/2 keyboard/mouse port
1 x D-Sub port
1 x DVI-D port
1 x HDMI port
4 x USB 3.1 Gen 1 ports
2 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks




Detalles del producto
12000043128701379

Ficha técnica

Hign-concerned Chemical
None
Brand Name
Gigabyte
Origin
Mainland China
Certification
weee
Package
No
Application
Desktop
RAID Supported
No
Processor compatibility
8th Intel Core i5,9th Intel Core i3,9th Intel Core i5,8th Intel Core i7,9th Intel Core i9,9th Intel Core i7,8th Intel Core i3
Usage Scenario
Enthusiast & Overclocking,Gaming,Audio & Video
Back I/O Ports
1x RJ45,VGA(D-Sub),HDMI 1.4,DVI-D
Onboard LAN
1x RJ45
Storage Interface Type
SATA,M.2 (NVMe)
Number of PCI
2
PCI - E standards
PCI - E 3.0
Support Memory Type
DDR4
Maximum Ram Capacity
64 GB
Form Factor
Micro-ATX
Chipset Manufacturer
Intel
With CPU
No
Chipset
Intel B360
Socket Type
LGA 1151
Quality Certification
ce
Ports
SATA
Special Features
None
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Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer motherboards

Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer motherboards

Gigabyte B360M DS3H original LGA 1151 DDR4 B360 desktop computer motherboards

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